TRANSCEND MTE662T2 1TB 3K P/E SSD disk M.2 2280, PCIe Gen3 x4 NVMe 1.3 (3D TLC), 3500MB/s R, 2700MB/s W, tray balení

TRANSCEND MTE662T2 1TB 3K P/E SSD disk M.2 2280, PCIe Gen3 x4 NVMe 1.3 (3D TLC), 3500MB/s R, 2700MB/s W, tray balení TRANSCEND MTE662T2 1TB 3K P/E SSD disk M.2 2280, PCIe Gen3 x4 NVMe 1.3 (3D TLC), 3500MB/s R, 2700MB/s W, tray balení

Transcend's MTE662T2 M.2 SSD features the PCI Express (PCIe) Gen 3 x4 interface and is compatible with NVM Express (NVMe) 1.3 specifications to achieve never-before-seen transfer speeds. The MTE662T2 features state-of-the-art 3D NAND technology, which allows 96 layers of 3D NAND flash chips to be vertically stacked. Compared to 3D NAND at 64 layers, this density breakthrough greatly improves storage efficiency, and its built-in DRAM cache allows faster access. Applied with 30µ" gold finger PCB and Corner Bond technology, the MTE662T2 is fully tested in-house to guarantee reliability in mission-critical applications, boasting an endurance rating of 3K Program/Erase cycles and an extended operating temperature ranging from -20?~75?.

Technologies:

- 96-layer 3D NAND Flash

- 30µ” PCB Gold Finger

- Corner Bond

- Extended Temperature

- Dynamic Thermal Throttling

- Thermal Sensor

- Read Disturbance

- Garbage Collection

- Wear Leveling

- TRIM

- Bad Block Management

- Early Move

Firmware Features:

- Supports NVM command

- LC caching technology-

- Dynamic thermal throttling

- Built-in LDPC ECC (Error Correction Code) functionality

- Advanced Global Wear-Leveling and Block management for reliability

- Advanced Garbage Collection

- Enhanced S.M.A.R.T. function for durability

- Full drive encryption with Advanced Encryption Standard (AES) (optional)

Hardware Features:

- Compliant with RoHS 2.0 standards

- Compliant with NVM Express specification 1.3

- Compliant with PCI Express specification 3.1

- Space-saving M.2 form factor (80mm) – ideal for mobile computing devices

- PCIe Gen 3 x4 interface

- DDR4 DRAM Cache embedded

- Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed

- Key components fortified by default with Corner Bond technology

- 30µ" PCB gold finger

- Promised operational reliability in an extended temperature range (from -20°C to 75°C)

- Supports Transcend Scope Pro software

Specifications:

Dimensions: 80 mm x 22 mm x 3.58 mm (3.15" x 0.87" x 0.14")

Weight: 9 g

Form Factor: M.2

M.2 Type: 2280-D2-M (Double-sided)

Bus Interface: NVMe PCIe Gen3 x4

Flash Type: 3D NAND flash

Capacity: 1 TB

Operating Voltage: 3.3V±5%

Operating Temperature: Extended-20°C ~ 75°C

Storage Temperature: -55°C (-67°F) ~ 85°C (185°F)

Humidity: 5% ~ 95%

Shock: 1500 G, 0.5 ms, 3 axis

Vibration (Operating): 20 G (peak-to-peak), 7 Hz ~ 2000 Hz (frequency)

Power Consumption (Operation): 7.0 watt(s)

Power Consumption (IDLE): 1.0 watt(s)

Sequential Read/Write (CrystalDiskMark):

- Read: up to 3,500 MB/s

- Write: up to 2,700 MB/s

4K Random Read/Write (IOmeter):

- Read: up to 340,000 IOPS

- Write: up to 355,000 IOPS

Mean Time Between Failures (MTBF): 3,000,000 hour(s)

Terabytes Written (TBW): up to 4,400 TBW

Drive Writes Per Day(DWPD): 2 (3 yrs)

Note

Speed may vary due to host hardware, software, usage, and storage capacity.

The workload used to rate DWPD may be different from your actual workload, which may vary due to host hardware, software, usage, and storage capacity.

Terabytes Written (TBW) expresses the endurance under the highest capacity.

Certificate : CE/FCC/BSMI

Warranty: Three-year Limited Warranty

Warranty does not apply when Scope Pro software wear-out indicator displays 0% within the warranty coverage.

Due to the complexity and variety of industrial applications, Transcend cannot guarantee 100% compatibility with all platforms and under all scenarios. For special applications and environments, it is strongly suggested that you contact Transcend beforehand for clarification.

Scope Pro software is required by request. Please contact us for more information.